Corn Next Brings Its CornNext-17 Natural Material Platform to PACK EXPO International 2026
Corn Next is bringing CornNext-17 to PACK EXPO International 2026 in Chicago. CornNext-17 is a natural material made from corn starch, water and enzymes, and it can be processed by extrusion and injection molding.
The piece covers how the platform is moving beyond drinking straws into cutlery and dry-powder scoops, and Corn Next’s search for industry partners to develop new packaging and non-durable applications. Find us at Booth LL-10414 in the Lakeside Lower hall, October 18 to 21.
